On 1st December, Serge Willenegger,SVP of Qualcomm and Uliya, Senior products marketing manager of Qualcomm paid avisit to GosuncnWelink Technology Co., Ltd. Shenzhen headquarters and had a meetingwith GosuncnWelink’s leadership. Gu Yongcheng, president of GosuncnWelink, Wang Peng,VP of GosuncnWelink and Lu Daming, director of module products line attended themeeting.

Accompanied by the leadership of GosuncnWelink,the guests first visited GosuncnWelink’s showroom and listened to the introductionof the company about the wireless communication module business, telematicsbusiness as well as the IoT solutions.

After that, the two sides sit down to have adiscussion meeting. At the meeting, Serge mainly introduced Qualcomm's plan tobuild a credible service platform, which will combine different parts of theindustrial chain such as chip manufacturers, platform manufacturers, value-addedservices manufacturers and others to share the benefits. Serge also appreciatedthe layout and current achievements GosuncnWelink have made in PoC (Push to Talkover Cellular) market and highly recognized the existing cooperation betweenGosuncnWelink and Qualcomm. Serge expected the two sides to innovate new businessmodels and deepen cooperation in the area of NB-IoT, eMTC, etc. In his part, GuYongcheng said that GosuncnWelink look forward to develop the bilateral practicalcooperation in both scale and depth and promote mutual benefit and commonprogress.

The partnership between GosuncnWelink and Qualcommhas a long history and most of GosuncnWelink’s module products are based on Qualcommchips. In early 2016, GosuncnWelink launched a 7 mode 4G module ME3630 which wasthe first module based on Qualcomm chip 9X07. GosuncnWelink NB-IoT module ME3612which won China Telecom’s NB-IoT module bidding this October is also based on Qualcommchip MDM9206.